AGP Executive Report
Last update: 4 hours agoMicrofabrication: Austrian company UpNano has unveiled 3D Adaptive Resolution, a printing method that adjusts detail during two-photon polymerisation to combine smooth, precise surfaces with faster production. Semiconductors: Infineon says it has produced working power devices on 300mm silicon-carbide wafers, which can yield more than twice as many chips as 200mm wafers. Tech Skills: Researchers at Vienna’s Complexity Science Hub and IT:U mapped software expertise across 976 cities, offering insight into where skills such as AI and cloud computing are concentrated. Space Technology: Vienna-based ENPULSION is partnering with US firm Orbion to give European satellite makers access to flight-proven Hall-effect propulsion alongside its own systems. Manufacturing: Vetropack has moved production of its lightweight, strengthened glass bottles to industrial scale at its Pöchlarn site, doubling output speed compared with its pilot plant. Climate: The last active glacier in Austria’s Alps has disappeared, underscoring the rapid retreat of ice in the Eastern Alps.
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